Back to results
US 7,604,835 B2Granted
Method for manufacturing wiring substrate and method for manufacturing electronic device
AssigneeSeiko Epson Corporation
InventorsHidemichi Furihata, Satoshi Kimura, Minoru Marumo
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a wiring substrate includes the steps of (a) providing a first surface-active agent in first and second areas and of a substrate, (b) providing a second surface-active agent in the first area of the substrate, (c) providing a catalyst on the second surface-active agent, and (d) depositing a metal layer on the catalyst to thereby form a wiring composed of the metal layer along the first area.
Claims4
A method for manufacturing a wiring substrate without using a mask, the method consisting of:
- (a) providing a cationic surface-active agent in first and second areas of a substrate;
- (b) providing an anionic surface-active agent in the first areas of the substrate and on the cationic surface-active agent to form a two-layer structure of the cationic surface-active agent and the anionic surface-active agent in the first areas, the anionic surface-active agent being provided in the first areas and on the cationic surface-active agent without using the mask by an ink jet method that disposes droplets consisting of an adhesive material that coats a core of the anionic surface-active agent;
- (c) providing a catalyst on either the two-layer structure of the cationic surface-active agent and the anionic surface-active agent in the first areas or on the cationic surface-active agent in the second areas, the catalyst provided on the two-layer structure being a positively charged catalyst and the catalyst provided on the cationic surface-active agent being a negatively charged catalyst;
- and
- (d) depositing a metal layer on the catalyst to thereby form a wiring composed of the metal layer along the first area.
2 more elements
Dependencies are inferred from the claim text.