Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus

A film forming method comprising:

• combining a linear movement in a column direction in which a nozzle passes along a substrate from one end of the substrate to the other end of the substrate with a movement in a row direction inside or outside the substrate to move the nozzle and substrate with respect to each other;
• continuously discharging a solution adjusted so as to spread over the substrate by a given amount through a discharge port disposed in the nozzle;
• holding the discharged solution on the substrate;
• and
• forming a liquid film, further comprising:
• obtaining a deviation amount of a discharge amount of the solution from a desired value with respect to a discharge position of the solution, when the solution is discharged onto the substrate from the nozzle moving in a first column;
• and
• controlling the discharge amount in an arbitrary position in a second column so as to compensate for the deviation amount obtained in an adjacent discharge position in the first column, when the solution is discharged onto the substrate from the nozzle moving in a second column disposed adjacent to the first column.