Methods and apparatus for selectively removing conductive material from a microelectronic substrate
AssigneeMicron Technology, Inc.
InventorsWhonchee Lee, Scott E. Moore, Scott G. Meikle
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AssigneeMicron Technology, Inc.
InventorsWhonchee Lee, Scott E. Moore, Scott G. Meikle
Estimating the term…
Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.
A method for removing a conductive material from a microelectronic substrate, comprising:
A method for removing material from a microelectronic substrate, comprising:
An apparatus for removing a conductive material from a microelectronic substrate, comprising:
An apparatus for removing material from a microelectronic substrate, comprising:
Dependencies are inferred from the claim text.