Platinum aluminide coating and method thereof
AssigneeHoneywell International Inc.
InventorsAlexander S. Kozlov, Derek Raybould, Siu-Ching D. Lui, Thomas E. Strangman
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Abstract
Platinum containing coatings for corrosion and oxidation protection of a substrate, and platinum electrodeposition methods for coating a substrate. The coating may comprise platinum and at least one supplementary constituent, and the method may involve co-electrodeposition of platinum and the supplementary constituent from a single electrolyte composition. The supplementary constituent may comprise chromium, an oxidation protective reactive element, or an alloy of chromium with a reactive element. Components protected by such coatings are also disclosed.
Claims24
A method for electroplating platinum, comprising:
- a) providing a substrate;
- b) electrolytically depositing a metal layer on a surface of said substrate, wherein said metal layer comprises platinum and a supplementary constituent, said supplementary constituent comprising particles selected from the group consisting of Cr, Si, Zr, and alloys thereof,
- wherein said metal layer is deposited from a single electrolyte composition during a single electrolytic step,
- wherein said electrolyte composition comprises a platinum salt and particles of said supplementary constituent having a mean particle diameter ranging between 1 micron and 10 microns and said particles do not include aluminum, and
- wherein said particles of said supplementary constituent are deposited in said metal layer from said electrolyte composition, and
- c) after said step b), aluminizing said metal layer of said substrate.
A method for electroplating platinum on a substrate, comprising:
- a) electroplating platinum metal on said substrate via an electrolyte comprising particles of a supplementary constituent and a reactive element, said supplementary constituent having a mean particle diameter ranging between 1 micron and 10 microns, and said particles not including aluminum;
- and
- b) concurrently with said step a), depositing said particles of said supplementary constituent on said substrate to form a layer comprising platinum and the particles of the supplementary constituent,
- wherein said supplementary constituent comprises particles selected from the group consisting of Cr, Si, Zr, and alloys thereof, and at least one reactive element selected from the group consisting of Y, Hf, La, Sc, Ta, and Re, and
- c) after said step b), aluminizing said layer comprising platinum and the particles of the supplementary constituent.
A process for preparing a coated component, comprising:
- a) providing a substrate;
- and
- b) electroplating a metal layer on a surface of said substrate from an electrolytic bath comprising a platinum salt electrolyte and particles of at least one supplemental constituent having a mean particle diameter ranging between 1 micron and 10 microns, wherein said electroplated metal layer comprises platinum metal and particles of the at least one supplementary constituent and at least one reactive element entrapped within said platinum metal, wherein said particles do not include aluminium and at least one supplementary constituent comprises particles selected from the group consisting of Cr, Si, Zr, and alloys thereof and the at least one reactive element is selected from the group consisting of Y, Hf, La, Sc, Ta, and Re;
- c) depositing aluminum on said electroplated metal layer;
- and
- d) forming a platinum aluminide coating on said substrate, wherein said platinum aluminide coating comprises said at least one supplementary constituent and at least one reactive element.
A process for preparing a coated component, comprising:
- a) providing a substrate;
- b) electroplating a platinum metal layer on said substrate, wherein said platinum metal layer is electrodeposited via an electrolyte composition comprising a platinum salt and chromium particles having a mean particle diameter ranging between 1 micron and 10 microns, said particles not including aluminum;
- c) concurrently with said step b), depositing said chromium particles on said substrate as part of the platinum metal layer, wherein said chromium particles are entrapped within said platinum metal layer;
- d) optionally, exposing said substrate to a first heat treatment;
- e) thereafter, aluminizing said substrate;
- and
- f) exposing said substrate to a second heat treatment to form a platinum aluminide coating on said substrate, wherein said platinum aluminide coating comprises:
- chromium within an intermetallic solid solution phase;
- and
- said chromium particles dispersed within said intermetallic solid solution phase.
Dependencies are inferred from the claim text.