Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor

A die for molding a semiconductor pressure sensor, said pressure sensor comprising:

• a sensor module in which a semiconductor pressure sensor part that converts a pressure to an electrical signal and a terminal of which part is extended to the outside are insert-molded with a first resin;
• and
• an outer case in which said sensor module is further insert-molded with a second resin to form a connector portion for external connection;
• wherein a back face of said sensor module is covered with said second resin;
• and said die comprising;
• a gate for molding the second resin;
• wherein said gate is provided on a backside of a plane, said plane extending through the boundary between the second resin and an exposed portion of the sensor module, said exposed portion including a portion which contains the semiconductor pressure sensor part.

A manufacturing method of a semiconductor pressure sensor comprising:

• forming a sensor module with a first resin by insert-molding a semiconductor pressure sensor part that converts a pressure to an electrical signal and a terminal having a part which extends to the outside;
• and
• forming an outer case having a connector portion with a second resin by further insert-molding so as to cover a back face of said sensor module,
• wherein a gate for molding the second resin is provided on a backside of a plane, said plane extending through the boundary between the second resin and an exposed portion of the sensor module, said exposed portion including a portion which contains the semiconductor pressure sensor part.