Methods of fabricating substrates including one or more conductive vias

A method of fabricating a substrate, comprising:

• providing at least one substrate blank having a surface and another, opposing surface;
• forming at least one aperture through the at least one substrate blank between the surface and the another, opposing surface;
• forming a first conductive layer over the surface of the at least one substrate blank, the another, opposing surface of the at least one substrate blank, and an inner surface of the at least one substrate blank within the at least one aperture;
• covering a portion of the first conductive layer with a mask material to define at least one conductive element extending over a portion of at least one of the surface and the another, opposing surface and over the inner surface by leaving another portion of the first conductive layer exposed;
• depositing a second conductive layer comprising a metal on a surface of the exposed another portion of the first conductive layer including within the at least one aperture;
• removing the mask material from the covered portion of the first conductive layer;
• removing the portion of the first conductive layer uncovered by the second conductive layer;
• and
• forming a third conductive layer over the second conductive layer, the third conductive layer extending at least partially over a lateral surface of the at least one conductive element.