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US 7,603,769 B2Granted
Method of coupling a surface mount device
AssigneeIntel Corporation
InventorMy Jang
Life of this patent
Estimating the term…
Abstract
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed there between, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.
Claims10
A method comprising:
- coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder;
- mounting an electronic device over the terminals with a conductive bonding material disposed there between;
- heating the conductive bonding material to melt the conductive bonding material;
- cooling the conductive bonding material;
- and
- removing the holder,
- wherein said removing the holder comprises dissolving the holder in a deflux solution.
4 more elements
A method comprising:
- coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, wherein said coupling the holder with the substrate comprises coupling a holder, including a material having a coefficient of thermal expansion that is greater than that of the substrate, with the substrate;
- mounting an electronic device over the terminals with a conductive bonding material disposed there between;
- heating the conductive bonding material to melt the conductive bonding material;
- thermally expanding the holder during said heating until a slanted sidewall of the holder contacts the electronic device;
- and
- cooling the conductive bonding material.
3 more elements
Dependencies are inferred from the claim text.