Device for inspecting and rotating electronic components

A device for picking up and rotating electronic components, wherein the electronic components are located on a substrate and picked up from that, for optically inspecting the electronic components with an optical inspection device located generally away from and directed towards an inspection area for inspection of the surface and/or the position of at least one electronic component arranged on the substrate when the electronic component is located in the inspection area before being picked up from the substrate, comprising:

• a rotationally pivoting part with an axis of rotation substantially parallel to the surface of the substrate;
• two pickup elements fixed to points on the pivoting part extended from the axis of rotation of the pivoting part, each for pickup of an electronic component located at the inspection area from the substrate and for holding the electronic component during a rotational movement of the pivoting part, where the two pickup elements are substantially 180 degrees from each other with respect to the axis of rotation of the pivoting part and face opposite each other;
• and
• wherein said pivoting part has a through opening arranged between the pickup elements such that an unobstructed optical path from the optical inspection device to the inspection area on the substrate is presented during the rotation of the pivoting part for some portion of a rotation of 180 degrees.

A device for checking and rotating electronic components, the device comprising:

• a pivoting part attached to a pivotal point for rotating the electronic components;
• a first pickup element disposed on a first exterior portion of the pivoting part for taking up a single electronic component from a substrate and keeping hold of it during a 180° rotational movement of the pivoting part to allow for a deposition of the held electronic component after completion of said 180° rotational movement onto a placing facility, which is moved away after said deposition, with the single electronic component being turned around after an executed 180° rotation;
• a second pickup element disposed on a second exterior portion of the pivoting part, the second pickup element being disposed 180° opposite the first pickup element in relation to the pivotal point such that in each case one pickup element is facing the substrate in a rotation of the pivoting part through a 180° rotation;
• and
• a through opening extending through the pivoting part between the first pickup element and the second pickup element such that the through opening is configured to face the substrate through a rotation of the first or second pickup elements of the pivoting part through 90° or 270°,
• wherein the pivoting part is arranged between the substrate and a first optical inspection device for checking a surface and/or a correct position of the single electronic component arranged on the substrate before being picked up from the substrate, and
• wherein the pivoting part has a rotational axis substantially parallel to the substrate, and
• wherein the through opening extends through the pivoting part such that through said 90° or 270° rotation of the pivoting part the first or second pickup elements do not block a view from the first optical inspection device towards the single electronic component arranged on the substrate before the single electronic component is picked up from the substrate.

A device for checking and rotating electronic components, the device comprising:

• a pivoting part attached to a pivotal point for rotating a single electronic component;
• a first pickup element is disposed on an exterior of said pivoting part for taking up the single electronic component from a substrate and keeping hold of it during a rotational movement;
• and
• a second pickup element is disposed on the exterior of the pivoting part 180 degrees opposite the first pickup element with respect to the pivotal point such that in each case one pickup element is facing the substrate for each rotation of the pivoting part through 180°,
• wherein the pivoting part being placed between the substrate and a first optical inspection device for checking a surface and/or a correct position of the single electronic component arranged on the substrate before being picked up from the substrate,
• wherein the pivoting part further comprises a through opening arranged between the first and the second pickup elements such that the through opening is facing the substrate for a rotation of the first or second pickup elements of the pivoting part through 90° or 270° such that during a 180° rotation of the pivoting part, the single electronic component is picked up from the substrate by the first pickup element,
• wherein, after a rotation through a first 90 degree rotation of the first or second pickup elements, an optical connection line between the first optical inspection device and a second electronic component arranged on the substrate through the vertically aligned through opening is provided, and a depositing of the chip on a placing facility arranged relocatably above the pivoting part takes place with the chip turned around after an executed 180 degree rotation, and
• wherein the second electronic component is picked up from the substrate by the second pickup element when the second pickup element is facing the substrate.