High temperature ceramic socket configured to test packaged semiconductor devices

A test assembly for use in testing integrated circuits comprising:

• a) a circuit board having a plurality of pads connectable to test equipment;
• and
• b) test socket assembly, the test socket assembly comprising:
• an integrally formed single piece socket formed substantially of an insulating material, the single piece socket having a top portion and a bottom portion, wherein the single piece socket has a plurality of holes formed therein, the holes being configured to receive a plurality of electrically conductive springs from the bottom portion of the single piece socket;
• a plurality of pins, each pin being positioned in one of the plurality of holes of the single piece socket, and each pin configured to receive a lead of the integrated circuit to be tested by non-zero insertion force of the leads of the integrated circuit through the top portion of the single piece socket;
• and
• the plurality of electrically conductive springs, each hole having therein a separate one of the electrically conductive springs;
• wherein the single piece socket is positionable on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins.

A method of forming a test socket assembly, comprising:

• providing an integrally formed single piece socket formed substantially of an insulating material, the single piece socket having a top portion and a bottom portion, wherein the single piece socket has a plurality of holes formed therein, the holes being configured to receive a plurality of electrically conductive springs from the bottom portion of the single piece socket, and
• providing a plurality of pins, each pin being positioned in one of the plurality of holes of the single piece socket, and each pin configured to receive a lead of the integrated circuit to be tested by non-zero insertion force of the leads of the integrated circuit through the top portion of the single piece socket;
• and
• positioning the single piece socket on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins.