Wireless communication apparatus and semiconductor device

A wireless communication apparatus, comprising:

• a mounting substrate including:
• a duplexer connected to an antenna terminal;
• a receiving amplifier and a transmitting amplifier individually connected to the duplexer;
• a processor unit having a receiving processor and a transmitting processor respectively connected to the receiving and transmitting amplifiers in a region spaced from the receiving and transmitting amplifiers, wherein the processor unit monolithically integrates the receiving and transmitting processors and a ground region placed between the receiving and transmitting processors on a semiconductor chip;
• and
• a baseband processor connected to the processor unit;
• a shield case configured to cover the receiving amplifier, the transmitting amplifier, and the processor unit;
• and
• a shield partition of a conductor provided in contact with the shield case, including,
• a first partition provided from a top panel of the shield case to a surface of the mounting substrate so as to separate the receiving and transmitting amplifiers by extending from an end of the shield case, and
• a second partition provided from the top panel to the surface of the mounting substrate by extending from another end of the shield case so as to face the first partition across the processing unit;
• and
• a cut provided from the top panel in the shield case so as to overlay the processor unit between the first and second partitions,
• wherein the ground region is electrically connected to the first and second partitions.