Heat dissipation device
AssigneeHon Hai Precision Industry Co., Ltd.
InventorZheng-Heng Sun
Life of this patent
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Abstract
An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the CPU, a fan attached to the heat sink, and an air guide member attached to the second electronic element. The air guide member includes a guiding portion to guide air from the fan to the second electronic element.
Claims18
A heat dissipation device for removing heat from a first electronic element and a second electronic element attached to a circuit board, the first electronic element being disposed adjacent the second electronic element, the second electronic element comprising a first surface facing the first electric element, and a second surface opposite to the first surface, the heat dissipation device comprising:
- a heat sink attached to the first electronic element, the heat sink comprising an air outlet;
- a fan attached to the heat sink and generating an airflow directed out from the air outlet;
- and
- an air guide member attached to and abutting against the second surface of the second electronic element and facing the air outlet of the heat sink, the air guide member comprising a guiding portion changing a direction of the airflow from a first direction perpendicular to the first surface of the second electronic element, to a second direction along the first surface.
A heat dissipation assembly comprising:
- a circuit board comprising a CPU, and a plurality of memory cards located at a side of the CPU, the memory cards extending upright from the circuit board, with bottoms of the memory cards connected to the circuit board;
- a heat sink attached to a top of the CPU and comprising a plurality of fins and a plurality of airflow passages defined between adjacent fins, the passages directed toward the memory cards;
- a fan attached to a top of the heat sink, and generating an airflow, the airflow being directed to the heat sink and directed outward by the passages of the heat sink;
- and
- a plurality of air guide members respectively attached to tops of the memory cards and each of the guide members comprising a guiding portion guiding the airflow directed out from the passages to flow from the top of the corresponding memory card to the bottom of the corresponding memory card.
A heat dissipation assembly comprising:
- a circuit board comprising an electronic component, and a plurality of parallel memory cards located at a side of the electronic component;
- a heat sink attached to a top of the electronic component and comprising a plurality of parallel fins with parallel airflow passages defined between every two adjacent thereof, the passages directed toward the memory cards;
- a fan attached to the heat sink and generating a airflow;
- and
- a plurality of air guide members respectively attached to tops of the memory cards and each of the air guide members comprising a guiding portion arranged slanted relative to the passages and changing the direction of airflow from a first direction parallel with the passages of the heat sink to a second direction towards the circuit board.
Dependencies are inferred from the claim text.