Multilayer chip capacitor
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsByoung Hwa Lee, Hae Suk Chung, Dong Seok Park, Min Cheol Park, Sang Soo Park, Sung Kwon Wi
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsByoung Hwa Lee, Hae Suk Chung, Dong Seok Park, Min Cheol Park, Sang Soo Park, Sung Kwon Wi
Estimating the term…
A multilayer chip capacitor includes a capacitor body having dielectric layers, and internal electrode layers separated from each other in the capacitor body by the dielectric layers. Each internal electrode layer has one or two leads and includes at least one coplanar electrode plate. External electrodes are electrically connected to the internal electrode layers via the leads. The internal electrode layers constitute a plurality of blocks stacked repeatedly. Each block includes a plurality of the internal electrode layers stacked successively. The leads extending to a face of the capacitor body are arranged in a zigzag shape along a stacking direction. The leads of vertically adjacent ones of the electrode plates having opposite polarities are arranged to be horizontally adjacent to each other.
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
A multilayer chip capacitor comprising:
Dependencies are inferred from the claim text.