Multilayer winding inductor
AssigneeVIA Technologies, Inc.
InventorSheng-Yuan Lee
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AssigneeVIA Technologies, Inc.
InventorSheng-Yuan Lee
Estimating the term…
A multilayer winding inductor. The inductor at least includes multi-level interconnect and single-level interconnect structures. The multi-level interconnect structure includes a plurality of conductive plugs and a plurality of looped conductive traces overlapping and separated from each other. Each looped conductive trace has a gap to define first and second ends and at least two conductive plugs disposed between the neighboring looped conductive traces. The single-level interconnect structure is located over the multi-level interconnect structure, comprising an uppermost looped conductive trace and a second conductive plug. The uppermost looped conductive trace has a gap to define first and second ends, and the second conductive plug is disposed between the second end of the uppermost looped conductive trace and the first end of the looped conductive trace adjacent thereto, thereby electrically connecting the multi-level and single-level interconnect structures.
A multilayer winding inductor, comprising:
An inductor formed in a semiconductor chip, comprising:
Dependencies are inferred from the claim text.