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US 7,598,758 B2Granted
MP3 micro probe
OwnerGabe Cherianinventor
Life of this patent
Estimating the term…
Abstract
Described are methods of using probes, for making electrical contact to high-density chips or similar electronic devices. Two groups of probes are covered. The first group includes probes that are moved laterally, parallel to the surface of the contact pads of the device under test, after the initial contact has been made. This is to create the desired wipe or scrub. The second group includes probes that operate on the principle of suction cups. When the probe is pushed against the device under test, the probe working tips stretch outwardly and create the desirable wipe or scrub. Described also are the probes themselves that are used for the above methods. In this divisional application, the emphasis is on the first group.
Claims20
A method for electrically connecting to a device, using a probe,
- said device having:
- a top surface generally along a plane, referred to as the x-y plane, said top surface referred to as device surface;
- at least a first and a second contact pads, referred to as device pads, said pads being disposed on and along said device surface, in a pattern, referred to as the device pattern;
- and the top surface of said device pads, referred to as pads surface, being generally parallel to said device surface;
- and with a center distance between the center of said first device pad, and the center of said second device pad, said center distance being referred to as the device pitch;
- said probe comprising:
- a first contact means, referred to as probe point, disposed on a carrier, wherein said carrier having means for electrically connecting said probe point to the outside world, and a second probe point, similarly disposed on said carrier, and similarly connected to the outside world, said first and second probe points being disposed in a pattern, referred to as the probe pattern, said probe pattern matching said device pattern, and with the center distance between the center of said first probe point;
- and the center of said second probe point, referred to as probe pitch, said probe pitch being equal in size to said device pitch, and said carrier being mounted on a working tip of a pusher, said pusher being capable of moving said working tip and said probe points in several directions;
- a first direction being generally perpendicular to said device surface and said pads surface, said perpendicular direction being referred to as the z-direction or the normal direction of said working tip, and a second direction being generally parallel to said device surface, along an arbitrary direction within said x-y-plane, referred to as the first lateral direction of said working tip, and a third direction again being generally parallel to said device surface, but at some angle to said first lateral direction, referred to as the second lateral direction of said working tip;
- wherein
- said method comprises the steps of
- moving the working tip in the normal direction, towards said device and said device pads, creating a normal force between said probe points and said device pads, said normal force being transferred from said pusher, then through said working tip of said pusher, and then through said carrier, and moving said working tip in the first lateral direction, while said normal force is still existing, thus creating a relative motion and a wiping action between said probe points and said device pads, in a direction parallel to said first lateral direction, said wiping action being referred to herein as the first lateral wipe or scrub, and moving said working tip in the second lateral direction, while said normal force is still existing, thus creating a relative motion and a wiping action between said probe points and said device pads, in a direction parallel to said second lateral direction, said wiping action being referred to herein as the second lateral wipe or scrub.
9 more elements
A probe for electrically connecting to a device,
- said device having:
- a top surface generally along a plane, referred to as the x-y plane, said top surface referred to as device surface;
- at least a first and a second contact pads, referred to as device pads, said pads being disposed on and along said device surface, in a pattern, referred to as the device pattern;
- and the top surface of said device pads, referred to as pads surface, being generally parallel to said device surface;
- and with a center distance between the center of said first device pad, and the center of said second device pad, said center distance being referred to as the device pitch;
- said probe comprising:
- a first contact means, referred to as probe point, disposed on a carrier, wherein said carrier having means for electrically connecting said probe point to the outside world, and a second probe point, similarly disposed on said carrier, and similarly connected to the outside world, said first and second probe points being disposed in a pattern, referred to as the probe pattern, said probe pattern matching said device pattern, and with the center distance between the center of said first probe point;
- and the center of said second probe point, referred to as probe pitch, said probe pitch being equal in size to said device pitch, and said carrier being mounted on a working tip of a pusher, said pusher being capable of moving said working tip and said probe points in several directions;
- a first direction being generally perpendicular to said device surface and said pads surface, said perpendicular direction being referred to as the z-direction or the normal direction of said working tip, and a second direction being generally parallel to said device surface, along an arbitrary direction within said x-y-plane, referred to as the first lateral direction of said working tip, and a third direction again being generally parallel to said device surface, but at some angle to said first lateral direction, referred to as the second lateral direction of said working tip;
- wherein
- when the working tip is moved in the normal direction, towards said device and said device pads, it creates a normal force between said probe points and said device pads, said normal force being transferred from said pusher, then through said working tip of said pusher, and then through said carrier and said probe points, and when the working tip is moved in the first lateral direction, while said normal force is still existing, a relative motion and a wiping action between said probe points and said device pads is created, in a direction parallel to said first lateral direction, said wiping action being referred to herein as the first lateral wipe or scrub, and when the working tip is moved in the second lateral direction, while said normal force is still existing, a relative motion and a wiping action between said probe points and said device pads is created, in a direction parallel to said second lateral direction, said wiping action being referred to herein as the second lateral wipe or scrub.
8 more elements
Dependencies are inferred from the claim text.