Inspection device and inspection method

An inspection device for inspecting electric characteristics of a semiconductor integrated circuit having a first external electrode on a first surface and a second external electrode on a second surface, said first and second surfaces being opposite to each other, said inspection device comprising:

• an inspection circuit board having a first electrode;
• a wiring board having a second electrode, said inspection circuit board and wiring board arranged such that the first and second electrodes face each other, and the wiring board is located in a moveable member, which is moveable relative to the inspection circuit board;
• a measuring device connected to the inspection circuit board;
• a holding part for holding the semiconductor integrated circuit located between the inspection circuit board and the wiring board;
• a first conductive contact pin for contacting the first electrode of the inspection circuit board and the first external electrode of the semiconductor integrated circuit facing the inspection circuit board, said first conductive contact pin located in a fixed member, which is fixed relative to the inspection circuit board, said first conductive contact pin being physically and electrically separable from each of the first electrode of the inspection circuit board and the first external electrode of the semiconductor integrated circuit;
• a second conductive contact pin for contacting the second electrode of the wiring board and the second external electrode of the semiconductor integrated circuit facing the wiring board, the second conductive contact pin located in the movable member, said second conductive contact pin being physically and electrically separable from each of the second electrode of the wiring board and the second external electrode of such semiconductor integrated circuit;
• a third electrode located on the inspection circuit board;
• a fourth electrode located on the wiring board, said fourth electrode electrically connected to the second electrode via a wiring circuit located in the wiring board;
• and
• a third conductive contact pin for independently connecting the third and fourth electrodes, said third conductive contact pin located in either the movable member or the fixed member, said third conductive contact pin being physically and electrically separable from each of said third and fourth electrodes;
• wherein the second and fourth electrodes are located on a planar surface of the wiring board, such that the second and fourth electrodes are located on the same plane,
• the moveable member is moveable to a contacting position in which the second conductive contact pin contacts the second external electrode of the semiconductor integrated circuit,
• the moveable member is movable to a separated position at which the second conductive contact pin is separated from the second external electrode, and
• the third conductive contact pin contacts the third electrode and the fourth electrode when the movable member is in the contacting position.