Semiconductor wafer examination method and semiconductor chip manufacturing method
AssigneeSeiko Epson Corporation
InventorsHideki Yuzawa, Kazuhiro Kijima
Life of this patent
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Abstract
A semiconductor wafer examination method that includes: preparing a wafer formed with a chip area for use as a semiconductor chip; firstly examining the wafer by probing; pressing an electrode of the wafer with a pressure member having a flat surface; and secondly examining the wafer by probing.
Claims30
A method of inspecting a semiconductor wafer, the method comprising:
- firstly inspecting the semiconductor wafer by firstly probing;
- pressing the semiconductor wafer at a first pressure;
- and
- secondly inspecting the semiconductor wafer by secondly probing,
- the semiconductor wafer having a chip that includes a transistor and an electrode,
- the chip being mounted at a second pressure after being diced from the semiconductor wafer,
- the first pressure being higher than the second pressure,
- the secondly inspecting being carried out to determine whether the failure is likely to occur when the chip is mounted at the second pressure that is lower than the first pressure.
A method of inspecting a semiconductor wafer, comprising:
- a.) firstly inspecting one of a plurality of chips in the wafer by firstly probing;
- b.) pressing an electrode on the semiconductor wafer at a first pressure;
- c.) secondly inspecting the semiconductor wafer by secondly probing,
- d.) each of the plurality of chips being mounted at a second pressure after being diced from the wafer,
- e.) the first pressure being higher than the second pressure, and
- f.) the secondly inspecting step being carried out to determine whether a failure occurs in the semiconductor wafer by the pressing of the electrode.
The method according to 15, the electrode including a pad and a bump, the bump being formed on the pad.
A method of inspecting a semiconductor wafer having a plurality of chips therein with a bumped electrode located above a transistor, the chips being mounted at a first pressure after being diced from the wafer, the method comprising:
- firstly inspecting the semiconductor wafer by firstly probing;
- pressing the electrode at a second pressure higher than the first pressure;
- secondly inspecting the semiconductor wafer by secondly probing;
- and
- detecting whether a failure by the pressing of the electrode has occurred or not.
Dependencies are inferred from the claim text.