Encapsulation of a chip module
AssigneeInfineon Technologies AG
InventorManfred Mengel
Life of this patent
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Abstract
A chip module with a substrate having a top side, a chip mounted on the top side of the substrate, and an encapsulation includes an encapsulation material. The encapsulation is applied on the chip and the top side of the substrate in such a way that the chip and the top side of the substrate are at least partly covered. The encapsulation material includes a polymer composition having at least a first polymer component and a second polymer component which are chemically covalently bonded by means of a crosslinker, the first polymer component imparting resistance toward a first class of chemically reactive compounds and the second polymer component imparting resistance toward a second class of chemically reactive compounds, the reactivities differing between the first and second classes of chemically reactive compounds.
Claims27
A chip module comprising:
- a substrate having a top side;
- a chip carrier mounted on the substrate top side and having a side that is curved;
- a curved chip mounted on the curved side of the chip carrier;
- and
- an encapsulation comprising an encapsulation material, which encapsulation is applied on the chip and the top side of the substrate such that the chip and the top side of the substrate are at least partly covered,
- wherein the encapsulation material comprises a polymer composition having at least a first polymer component and a second polymer component which are chemically covalently bonded by means of a crosslinker, the first polymer component imparting resistance toward a first class of chemical attacks by chemically reactive compounds and the second polymer component imparting resistance toward a second class of chemical attacks by chemically reactive compounds, and
- wherein the respective chemically reactive compounds of the first and second classes of chemical attacks each have differing reactivities with the first and second polymer components.
A chip module comprising:
- a substrate having a substrate top side;
- a chip carrier mounted on the substrate top side and having a side that is curved;
- a curved chip having a chip top side and a chip underside, the chip underside facing the curved side of the chip carrier;
- and
- an encapsulation, which comprises an encapsulation material, applied to at least one region of the chip top side and to at least one region of the substrate top side,
- wherein the encapsulation material comprises a network-spanning polymer composition having at least a first polymer component and a second polymer component which are chemically covalently bonded by means of a crosslinker, the first polymer component imparting resistance toward a first class of chemical attacks by chemically reactive compounds and the second polymer component imparting resistance toward a second class of chemical attacks by chemically reactive compounds, and
- wherein the respective chemically reactive compounds of the first and second classes of chemical attacks each have differing reactivities with the first and second polymer components.
Dependencies are inferred from the claim text.