Semiconductor device with side terminals
AssigneePanasonic Corporation
InventorYoshiki Takayama
Life of this patent
Estimating the term…
Abstract
Side terminals 3 at respective corners of a package are higher than side terminals 4 on each side of the package. Thus, even if the side terminals 4 on each side are lower than those according to the conventional art owing to miniaturization or the like, when a device is mounted on a mounting substrate by soldering, a solder fillet 11 of a sufficient size can be formed between each of the corner side terminals 3, which significantly affect reliability, and a corresponding terminal on the mounting substrate. Thus, the device can be more reliably mounted on the mounting substrate by soldering.
Claims17
A semiconductor device with side terminals comprising a chip sealed in a package, the semiconductor device further comprising:
- a plurality of first side terminals serving as external terminals provided on each of side surfaces of the package;
- and
- a second side terminal serving as an external terminal provided at at least one corner of the side surfaces of the package, the second side terminal being higher than each of the first side terminals.
A semiconductor device with side terminals comprising a chip sealed in a package, the semiconductor device further comprising:
- a second side terminal serving as an external terminal provided only at at least one corner of side surfaces of the package.
Dependencies are inferred from the claim text.