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US 7,598,609 B2Granted
Structure of polymer-matrix conductive film and method for fabricating the same
AssigneeIndustrial Technology Research Institute
InventorsRuoh Huey Uang, Yu Chih Chen, Ren Jay Lin, Syh Yuh Cheng
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Abstract
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
Claims31
A polymer-matrix conductive film, comprising:
- a polymer-matrix conductive body with unidirectional conductivity, including a plurality of solid conductive nanowires arranged parallel and spaced apart from each other and a polymer material filled in spacings of said solid conductive nanowires, wherein each end of each said solid conductive nanowire has a barrier layer and a solder layer both of which contained in said polymer-matrix conductive body.
A polymer-matrix conductive film, comprising:
- a polymer-matrix conductive body with unidirectional conductivity, including a plurality of conductive lines arranged parallel and spaced apart from each other and a polymer material filled in spacings of said conductive lines;
- a plurality of conductive pads on one side of said polymer-matrix conductive body along the direction of conductivity;
- a dielectric layer having a plurality of openings on the other side of said polymer-matrix conductive body along the direction of conductivity;
- and
- a conductive redistribution layer under said dielectric layer.
2 more elements
A polymer-matrix conductive film, comprising:
- a polymer-matrix conductive body with unidirectional conductivity, including a plurality of conductive lines arranged parallel and spaced apart from each other and a polymer material filled in spacings of said conductive lines;
- and
- a plurality of conductive pads on one side of said polymer-matrix conductive body along the direction of conductivity, each of said conductive pads contacting several of said conductive lines.
A semiconductor device package, comprising:
- a substrate having a circuit pattern and a plurality of first pads, said first pads electrically connected to said circuit pattern;
- a plurality of stacked polymer-matrix conductive films, wherein each of said polymer-matrix conductive films has a polymer-matrix conductive body with unidirectional conductivity, and said polymer-matrix conductive body includes a plurality of conductive lines arranged parallel and spaced apart from each other and a polymer material filled in spacings of said conductive lines and a plurality of conductive pads on one side of said polymer-matrix conductive body, each of said conductive pads contacting several of said conductive lines, in which said respective conductive pads of said polymer-matrix conductive films have different sizes and pitches, said polymer-matrix conductive films are stacked over said substrate, and said polymer-matrix conductive film with a lower surface adjacent to said substrate is electrically connected to said first pads of said substrate by said conductive pads thereof, and said stacked polymer-matrix conductive films adjacent to each other are electrically connected to each other by said respective conductive pads of said overlying polymer-matrix conductive film in a way that said respective conductive pads of said adjacent polymer-matrix conductive films corresponding to each other partially overlap to each other, whereby a conductive layer redistribution is obtained by said stacked polymer-matrix conductive films, in which said stacked polymer-matrix conductive films have an upper surface providing smaller I/O pitches than that providing by a lower surface thereof;
- and
- a chip having a plurality of second pads on one side thereof contacting the upper surface of said tacked polymer-matrix conductive films opposite to said substrate, wherein said second pads have pitches smaller than that of said first pads, and said chip electrically connected to said polymer-matrix conductive film adjacent thereto by said second pads, in which said second pads partially overlap said conductive pads of said adjacent polymer-matrix conductive film corresponding thereto.
1 more element
A semiconductor package device, comprising:
- a substrate having a circuit pattern and a plurality of first pads, said first pads electrically connected to said circuit pattern;
- a polymer-matrix conductive film, including a plurality of solid conductive nanowires arranged parallel and spaced apart from each other and a polymer material filled in spacings of said solid conductive nanowires, one end of said solid conductive nanowires contacting said first pads;
- and
- a chip on one side of said polymer-matrix conductive film opposite to said substrate, having a plurality of second pads on one side of said chip contacting said polymer-matrix conductive film, and said second pads contacting the other end of said solid conductive nanowires such that said substrate is electrically coupled to said chip by said polymer-matrix conductive film.
1 more element
A semiconductor package device, comprising:
- a substrate having a circuit pattern and a plurality of first pads, said first pads electrically connected to said circuit pattern;
- a polymer-matrix conductive film having a polymer-matrix conductive body with unidirectional conductivity, wherein said polymer-matrix conductive body includes a plurality of conductive lines arranged parallel and spaced apart from each other, a polymer material filled in spacings of said conductive lines, a plurality of conductive pads on one side of said polymer-matrix conductive body along the direction of conductivity each of said conductive pads contacting several of said conductive lines, and a conductive redistribution layer on the other side of said polymer-matrix conductive body opposite to said conductive pads, said polymer-matrix conductive film is stacked over said substrate, and said conductive redistribution layer enlarges I/O pitches of said polymer-matrix conductive film electrically contacting said first pads of said substrate;
- and
- a chip on one side of said polymer-matrix conductive film opposite to said substrate, having a plurality of second pads with pitches smaller than that of said first pads on one side of said chip contacting said polymer-matrix conductive film for contacting said conductive pads such that said substrate is electrically coupled to said chip via said polymer-matrix conductive film.
1 more element
Dependencies are inferred from the claim text.