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US 7,598,606 B2Granted
Integrated circuit package system with die and package combination
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Ming Ying, Il Kwon Shim
Life of this patent
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Abstract
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.
Claims13
An integrated package system with die and package combination comprising:
- forming a leadframe having internal leads and external leads;
- encapsulating a first integrated circuit on the leadframe;
- attaching a conductive layer over the encapsulation of the first integrated circuit;
- and
- encapsulating a second integrated circuit over the encapsulated first integrated circuit.
2 more elements
An integrated package system with die and package combination comprising:
- a leadframe having internal leads and external leads;
- a first integrated circuit encapsulated by a first encapsulant on the leadframe;
- a conductive layer over the encapsulation of the first integrated circuit;
- and
- a second integrated circuit encapsulated with the first encapsulant by a second encapsulant.
2 more elements
Dependencies are inferred from the claim text.