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US 7,598,604 B2Granted
Low profile semiconductor package
AssigneeKabushiki Kaisha Toshiba
InventorRyoji Matsushima
Life of this patent
Estimating the term…
Abstract
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor element are stacked to expose each electrode pad and bonded while facing the electrode forming surfaces each other. The electrode pads of the first and second semiconductor elements are connected to the first and second connection terminals via bonding wires. A metal circuit board including the first and second connection terminals, and the first and second semiconductor elements are sealed by a sealing material such that parts of the respective connection terminals expose.
Claims16
A semiconductor device, comprising:
- a first semiconductor element including an electrode forming surface having a first electrode pad thereon;
- a second semiconductor element including an electrode forming surface having a second electrode pad thereon, the electrode forming surface of the second semiconductor element bonding to the electrode forming surface of the first semiconductor element via an adhesive layer so that the first and second electrode pads expose, respectively;
- a metal circuit board having a first connection terminal and a second connection terminal arranged outside the first and second semiconductor elements, the first connection terminal connecting to the first electrode pad via a first bonding wire and the second connection terminal connecting to the second electrode pad via a second bonding wire;
- and
- a sealing material sealing the first and second semiconductor elements and the metal circuit board so that parts of the first and second connection terminals expose, wherein
- the first and second connection terminals each have,
- an outside connection terminal of a thickness substantially corresponding to a total thickness of the first and second semiconductor elements, and
- an inside connection terminal formed continuously from the outside connection terminal, the inside connection terminal having a thickness thinner than the thickness of the outside connection terminal, and
- the first and second bonding wires are accommodated within the total thickness of the first and second semiconductor elements.
6 more elements
A semiconductor device, comprising:
- a first semiconductor element including an electrode forming surface having a first electrode pad thereon;
- a second semiconductor element including an electrode forming surface having a second electrode pad thereon, the electrode forming surface of the second semiconductor element bonding to the electrode forming surface of the first semiconductor element via an adhesive layer so that the first and second electrode pads expose, respectively;
- a metal circuit board having a first connection terminal and a second connection terminal arranged outside the first and second semiconductor elements, the first connection terminal connecting to the first electrode pad via a first bonding wire and the second connection terminal connecting to the second electrode pad via a second bonding wire;
- and
- a sealing material sealing the first and second semiconductor elements and the metal circuit board so that parts of the first and second connection terminals expose,
- wherein the metal circuit board includes a first metal circuit board having a first die pad portion bonded to the electrode forming surface of the first semiconductor element and the second connection terminal, and a second metal circuit board having a second die pad portion bonded to the electrode forming surface of the second semiconductor element and the first connection terminal,
- wherein a total thickness of the first and second metal circuit board is about equivalent to a total thickness of the first and second semiconductor elements, the first and second die pad portions are disposed in the total thickness of the first and second semiconductor elements, and the first and second bonding wires are accommodated within the total thickness of the first and second semiconductor elements.
4 more elements
A circuit device, comprising:
- a mounting board including mounting pads;
- a plurality of semiconductor devices stacked and mounted on the mounting board, wherein each of the semiconductor devices comprises:
- a first semiconductor element including an electrode forming surface having a first electrode pad thereon,
- a second semiconductor element including an electrode forming surface having a second electrode pad thereon, the electrode forming surface of the second semiconductor element bonding to the electrode forming surface of the first semiconductor element via an adhesive layer so that the first and second electrode pads expose, respectively,
- a metal circuit board having a first connection terminal and a second connection terminal arranged outside the first and second semiconductor elements, the first connection terminal connecting to the first electrode pad via a first bonding wire and the second connection terminal connecting to the second electrode pad via a second bonding wire, and
- a sealing material sealing the first and second semiconductor elements and the metal circuit board so that parts of the first and second connection terminals expose;
- and
- a connection portion electrically connecting the mounting pads of the mounting board and the first and second connection terminals of the semiconductor device,
- wherein the connection terminals of the semiconductor devices are respectively connected via a conductive connection material, and the connection terminals of the uppermost semiconductor device and the mounting pads are connected via bonding wires.
6 more elements
Dependencies are inferred from the claim text.