Semiconductor package system with substrate having different bondable heights at lead finger tips
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Ming Ying, Il Kwon Shim, Lip Seng Tan
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Abstract
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
Claims18
A semiconductor package system comprising:
- providing a die attach paddle;
- providing a first plurality of leads including a plurality of outer leads around the die attach paddle having a first plurality of lead tips;
- providing a second plurality of leads including a plurality of inner leads around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips;
- attaching a first die to the die attach paddle;
- wire bonding the die to the first plurality of leads and the second plurality of leads;
- and
- encapsulating the die.
A semiconductor package system, comprising:
- providing a die attach paddle;
- providing a plurality of outer leads around the periphery of the die attach paddle;
- providing a plurality of inner leads around the periphery of the die attach paddle;
- providing a plurality of depression lead tips on at least some of the inner leads;
- attaching a first die to the die attach paddle;
- wire bonding the first die to the plurality of outer leads and the plurality of depression lead tips;
- and
- encapsulating the die, the plurality of outer leads, and the plurality of inner leads.
A semiconductor package system comprising:
- a die attach paddle;
- a first plurality of leads provides a plurality of outer leads having a first plurality of lead tips around the die attach paddle;
- a second plurality of leads provides a plurality of inner leads interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips;
- a first die attached to the die attach paddle;
- a first plurality of wires bonding the die to the first plurality of leads and the second plurality of leads;
- and
- an encapsulant encapsulating the die.
Dependencies are inferred from the claim text.