Wafer-scale microcolumn array using low temperature co-fired ceramic substrate
AssigneesElectronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Sunmoon University
InventorsJin Woo Jeong, Dae Jun Kim, Sang Kuk Choi, Dae Yong Kim, Ho Seob Kim
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Abstract
Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.
Claims11
A wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate comprising:
- a LTCC substrate having wirings;
- wafer-scale beam deflector arrays attached to at least one side of the LTCC substrate each comprising a plurality of deflection devices deflecting electron beams, and wherein the beam deflectors are an upper beam deflector and a lower beam deflector with respect to the LTCC substrate,
- a wafer-scale lens array which is attached to the beam deflector array and has a plurality of lenses whose centers are aligned with the center of the deflection device;
- and a wafer-scale electron emission source array supplying electron beams to the lens array.
Dependencies are inferred from the claim text.