Semiconductor chip and method for manufacturing the same and semiconductor device
AssigneeNEC Electronics Corporation
InventorsMasaya Kawano, Tsutomu Tashiro, Yoichiro Kurita
Life of this patent
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Abstract
The semiconductor chip 1 has a semiconductor substrate 10. In the present embodiment, the semiconductor substrate 10, which is an SOI substrate, is constituted by comprising a support substrate 12, an insulating layer 14 formed on the support substrate 12 with a layered structure, and a silicon layer 16 formed on the insulating layer 14 with the layered structure. The semiconductor substrate 10 has a circuit forming region A1 provided in the silicon layer 16. An insulating region 18 is provided on the semiconductor substrate 10. The insulating region 18 is provided so as to surround the entire side face of the circuit forming region A1.
Claims7
A semiconductor chip comprising:
- a semiconductor substrate having a circuit forming region,
- wherein said semiconductor substrate has an insulating layer contacting a bottom face of said circuit forming region and a first insulating region surrounding the entire side face of said circuit forming region, and
- wherein said semiconductor substrate comprises a metal film contacting said first insulating region and surrounding said first insulating region.
Dependencies are inferred from the claim text.