High voltage device
AssigneeUnited Microelectronics Corp.
InventorAnchor Chen
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Abstract
The invention is directed to a method for manufacturing a high voltage device. The method includes steps of providing a substrate and then forming a first doped region having a first conductive type in the substrate. At least two second doped regions having a second conductive type are formed in the substrate. The second doped regions are located adjacent to both sides of the first doped region respectively, and the first doped region is separated from the second doped regions with an isolation region. A gate structure is formed on the substrate between the second doped regions and a source/drain region having the second doped region is formed in the substrate adjacent to both sides of the gate structure.
Claims6
A high voltage device, comprising:
- a plurality of isolation structures located in a substrate;
- a first doped region having a first conductive type, wherein the first doped region is located in the substrate between the isolation structures;
- at least two second doped regions having a second conductive type, wherein the second doped regions are located adjacent to both sides of the first doped region respectively;
- at least two isolation regions located in the substrate between the first doped region and the second doped regions;
- a gate structure located on the substrate between the second doped regions;
- and
- a source/drain region having the second conductive type, wherein the source/drain region is located in the substrate adjacent to both sides of the gate structure.
Dependencies are inferred from the claim text.