High heat dissipating LED having a porous material layer
AssigneeIndustrial Technology Research Institute
InventorsChun Chieh Yang, Hong-Xi Cao, Chia-Tai Kuo, Chih-Li Chen, Cheng-Fa Chen, Ji-Bin Horng
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Abstract
A high power LED has at least a porous material layer, a thermal conductive layer and a chip. The thermal conductive layer is disposed on the surface of the porous material layer and the chip is disposed on the thermal conductive layer. Heat generated by the chip is conducted from the thermal conductive layer to the porous material layer, and convected outside via the porous material layer. Thereby, surface area in contact with the air is increased and high thermal conductivity and high heat convection are also achieved.
Claims20
A high power light emitting diode (LED), comprising:
- a first porous material layer;
- a thermal conductive layer disposed on a surface of the first porous material layer;
- a second porous material layer (a) that is disposed on the thermal conductive layer, on a side thereof opposite the first porous material layer and not in contact with the first porous material layer, to partially cover the thermal conductive layer, and (b) that has an opening defined therein,
- a chip disposed on the thermal conductive layer within the opening defined in the second porous material layer so that the chip is exposed to contact with air, and
- an interface layer provided between the second porous material layer and the thermal conductive layer for adhering the second porous material layer and the thermal conductive layer together,
- wherein the first porous material layer and the second porous material layer are composed of a porous ceramic material, and the interface layer comprises at least one bump.
Dependencies are inferred from the claim text.