Electronic board, method of manufacturing the same, and electronic device

An electronic board comprising:

• a substrate;
• an electronic circuit on the substrate, the electronic circuit having connection terminals;
• a stress-relaxation layer on the substrate, the stress-relaxation layer being formed of a dielectric material;
• a rearrangement wiring for the connection terminal, the rearrangement wiring being disposed at a top side of the stress-relaxation layer;
• a first wiring that extends from one of the connection terminals, the one of the connection terminals being disposed lateral to the stress-relaxation layer, a part of the first wiring being covered by the stress-relaxation layer, another part of the first wiring not being covered by the stress-relaxation layer;
• a first electrode disposed between the substrate and the stress-relaxation layer, the first electrode being at least a portion of the part of the first wiring;
• a second wiring that extends from another one of the connection terminals, the another one of the connection terminals being disposed lateral to the stress-relaxation layer, at least a part of the second wiring being disposed at the top side of the stress-relaxation layer;
• a second electrode disposed at the top side of the stress-relaxation layer, the second electrode being at least a portion of the part of the second wiring;
• and
• a capacitor including the first electrode, a part of the stress-relaxation layer, and the second electrode, the capacitor being formed at a region where the first wiring and the second wiring overlap in a plan view,
• wherein the second wiring is a part of the rearrangement wiring.