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US 7,598,157 B2Granted
Wafer dicing method
AssigneeAtomic Energy Countil-Institute of Nuclear Energy Research
InventorsChih-Hung Wu, Chieh Cheng, Kai-Sheng Chang, Kuan-Yu Chu
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Abstract
A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.
Claims5
A wafer dicing method, comprising steps of:
- (a) deposing a wafer on a mounting layer, said wafer having a plurality of chips located on a surface of said wafer, said mounting layer having a plurality of holes, said holes being partially corresponding to said chips;
- and
- (b) cutting said wafer with a cutting device to obtain said plurality of chips,
- wherein said chips on said wafer and said holes on said mounting layer have a contact area having a ratio between 1 percent and 50 percent.
1 more element
Dependencies are inferred from the claim text.