Device and method for bonding wafers

A device for bonding first and second wafers (22, 26) on corresponding surfaces (22o, 26o) of the first and second wafers (22, 26), the device having the following features:

• a. a unit (43) for applying a layer of bonding agent (44) to at least one of the corresponding surfaces (22o, 26o) of the first and second wafers (22, 26),
• b. a first device (20) for receiving and possibly aligning the first wafer (22),
• c. a second device (41) for receiving and aligning the second wafer (26) with respect to the first wafer (22), and
• d. a control unit (40) effecting the following process steps one after the other:
• i. applying a layer of bonding agent (44) to at least one of the corresponding surfaces (22o, 26o) of the first and second wafers by means of a unit (43) for applying the bonding agent,
• ii. contacting the corresponding surfaces (22o, 26o) of the first and second wafers (22, 26) by means of the first and second devices (20, 41),
• iii. aligning the second wafer (26) with respect to the first wafer (22) by aligning means along the corresponding surfaces (22o, 26o) of the first and second wafers (22, 26) in contact, and
• iv. bonding the corresponding surfaces (22o, 26o) of the first and second wafers by curing the bonding agent (44).