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US 7,598,124 B2Granted
System and method to increase die stand-off height
AssigneeTexas Instruments Incorporated
InventorCharles Anthony Odegard
Life of this patent
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Abstract
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate positioned generally parallel with, and spaced apart from, the die, and the first face being opposite the second face. The plurality of separator pedestals are operable to selectively force the die and substrate apart, increasing the stand-off height of the flip chip assembly.
Claims18
A method of increasing die stand-off height in a flip chip, comprising:
- disposing a plurality of separator pedestals between a first face of a die and a second face of a substrate;
- the first face being generally parallel with, spaced apart from, and opposite the second face;
- and
- the plurality of separator pedestals being operable to selectively force the die and substrate apart.
1 more element
Dependencies are inferred from the claim text.