US 7,598,023 B2 · Process for fabricating micro-display

Abstract

A process for fabricating a micro-display is provided. First, a wafer having a driving circuit thereon is provided. Then, a metallic reflective layer is formed on the wafer. Thereafter, an anti-reflection layer and a patterned photoresist layer are sequentially formed on the metallic reflective layer. Using the patterned photoresist layer as an etching mask, the anti-reflection layer and the metallic reflective layer are etched to form a trench pattern that exposes the surface of the wafer. After that, the patterned photoresist layer is removed. A dielectric layer is formed to cover the anti-reflection layer and fill the trench pattern. Then, a portion of the dielectric layer and the anti-reflection layer are removed to expose the surface of the metallic reflective layer.

Claims21

Dependent claims

A process for fabricating a micro-display, comprising:

providing a wafer, wherein the wafer has a driving circuit formed thereon;
forming a metallic reflective layer on the wafer;
forming an anti-reflection layer and a patterned photoresist layer in sequence over the metallic reflective layer;
forming a trench pattern in the anti-reflection layer and the metallic reflective layer using the patterned photoresist layer as an etching mask to expose the surface of the wafer;
removing the patterned photoresist layer;
forming a dielectric layer to cover the anti-reflection layer and fill the trench pattern;
and
removing the dielectric layer and the anti-reflection layer above a top surface of the metallic reflective layer until the surface of the metallic reflective layer is exposed, so that a remained dielectric layer and the metallic reflective layer with the trench pattern are remained to form a part of the micro-display.

5 more elements

A process for fabricating a micro-display, comprising:

providing a wafer, wherein the wafer has a driving circuit formed thereon;
forming a metallic reflective layer on the wafer;
forming a first dielectric layer, an anti-reflection layer and a patterned photoresist layer in sequence over the metallic reflective layer;
forming a trench pattern in the anti-reflection layer, the first dielectric layer and the metallic reflective layer using the patterned photoresist layer as an etching mask to expose the surface of the wafer;
removing the patterned photoresist layer;
forming a second dielectric layer to cover the anti-reflection layer and fill the trench pattern;
and
removing the second dielectric layer, the anti-reflection layer and the first dielectric layer above a top surface of the metallic reflective layer until the surface of the metallic reflective layer is exposed, so that a remained second dielectric layer and the metallic reflective layer with the trench pattern are remained to form a part of the micro-display.

5 more elements

Dependencies are inferred from the claim text.

Process for fabricating micro-display

Life of this patent

Process for fabricating micro-display

Life of this patent

Abstract

Claims21