Back to results
US 7,598,014 B2Granted
Thick film photoresist composition and method of forming resist pattern
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsYasushi Washio, Koji Saito
Life of this patent
Estimating the term…
Abstract
A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group, (B) a polymerizable compound containing at least one ethylenic unsaturated double bond, (C) a photopolymerization initiator, and (D) an organic solvent.
Claims5
A thick film photoresist composition comprising:
- (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from dicyclopentanyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group,
- (B) a polymerizable compound containing at least one ethylenic unsaturated double bond,
- (C) a photopolymerization initiator, and
- (D) an organic solvent.
1 more element
Dependencies are inferred from the claim text.