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US 7,598,009 B2Granted
Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device
AssigneeFUJIFILM Corporation
InventorsKenichiro Sato, Naoya Sugimoto
Life of this patent
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Abstract
According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at least two sulfonate ester groups; a production method for a cured relief pattern using the photosensitive resin composition; and a semiconductor device containing the cured relief pattern formed according to the production method.
Claims8
A photosensitive resin composition comprising:
- (A) a polyamide resin comprising a structure represented by general formula (1);
- (B) a photosensitive agent;
- and
- (C) a sulfonate ester represented by general formula (2),
- wherein R1 represents a 2-valent to 8-valent organic group having at least 2 carbon atoms;
- R2 represents a 2-valent to 6-valent organic group having at least 2 carbon atoms;
- G and R3 each independently represents a hydrogen atom or an organic group having from 1 to 20 carbon atoms;
- m indicates an integer of from 0 to 2;
- p and q each independently indicates an integer of from 0 to 4, provided that p+q>0,
- wherein A represents an h-valent linking group;
- R0 represents an alkyl group, an aryl group, an aralkyl group or a cyclic alkyl group;
- R0′ represents a hydrogen atom, an alkyl group or an aralkyl group;
- and
- h indicates from 2 to 8.
11 more elements
Dependencies are inferred from the claim text.