Material composition for packaging of light-sensitive components and method of using the same
AssigneeEternal Chemical Co., Ltd.
InventorsTsai-Fa Hsu, Fu-Lung Jeng
Life of this patent
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Abstract
The invention pertains to a material composition for packaging. The composition comprises (a) an epoxy resin and (b) a curing agent, wherein the mixing ratio of said epoxy resin to said curing agent is in the range of from 0.7 to 1.1. The invention also pertains to a method of using said material composition for packaging a light-sensitive component on a substrate.
Claims10
A material composition for packaging consisting essentially of (a) an epoxy resin selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, an aliphatic epoxy resin, and a cycloaliphatic epoxy resin, and a mixture thereof, and (b) a curing agent selected from acid anhydrides, and (c) a promoter selected from the group consisting of the quatemary ammonium salts, imidazole compounds, and salts of 1,8-diazabicyclo[5,4,0]-undec-7-ene, and a mixture thereof, wherein the mixing ratio by weight of said epoxy resin to said curing agent is in the range of from 0.7 to 1.1.
A material composition for packaging an image sensor consisting essentially of (a) an epoxy resin selected from the group consisting of an aliphatic epoxy resin, and a cycloaliphatic epoxy resin, and a mixture thereof, (b) a curing agent selected from acid anhydrides and (c) a promoter selected from the group consisting of the quaternary ammonium salts, imidazole compounds, and salts of 1,8-diazabicyclo[5,4,0]-undec-7-ene, and a mixture thereof, wherein the mixing ratio by weight of said epoxy resin to said curing agent is in the range of from 0.7 to 1.1.
Dependencies are inferred from the claim text.