Element substrate and method of manufacturing the same
AssigneeSeiko Epson Corporation
InventorsToshihiko Kaneda, Satoshi Kimura, Hidemichi Furihata, Takeshi Kijima
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates; pouring a resin material in a fluid state between the first and second support substrates; curing the resin material to form a resin substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate.
Claims8
A method of manufacturing an element substrate comprising:
- (a) forming a release layer on a first support substrate;
- (b) forming a metal layer having a predetermined pattern on the release layer;
- (c) disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates;
- (d) pouring a resin material in a fluid state between the first and second support substrates;
- (e) curing the resin material to form a resin substrate;
- (f) removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate;
- and
- (g) forming a resin section having the same predetermined pattern as the metal layer has on the first support substrate before the step (a);
- wherein the release layer is formed on the resin section in the step (a).
Dependencies are inferred from the claim text.