Methods and apparatuses for electrochemical deposition
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Wen Su, Ming-Hsing Tsai
Life of this patent
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Abstract
Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode.
Claims8
An apparatus for electrochemical depositing a metal layer onto a substrate, comprising:
- a substrate holder assembly including a substrate chuck, and a relatively soft cathode contact ring, the cathode contact ring having an inner conductive liquid portion and an outer polymer portion, wherein the inner conductive liquid portion of the cathode contact ring comprises mercury or KCl solution;
- an electrolyte container;
- an anode disposed in the electrolyte container;
- and
- a power supply connecting the substrate holder assembly and the anode.
An apparatus for electrochemical depositing a metal layer onto a substrate, comprising:
- a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring with an inner conductive liquid portion encapsulated by an outer polymer portion, the inner conductive liquid portion conformably contacting an electroplating surface of a substrate, wherein the inner conductive liquid portion of the cathode contact ring comprises mercury or KCl solution;
- an electrolyte container;
- an anode disposed in the electrolyte container;
- and
- a power supply connected to the cathode and the anode.
A method of electrochemical deposition comprising:
- providing a substrate having a barrier layer and a seed layer thereon;
- conformably contacting the substrate with a soft cathode contact ring;
- and
- electrochemically depositing a metal layer on the substrate in an electrochemical plating cell, wherein the cathode contact having an inner conductive liquid portion is encapsulated by an outer polymer portion, and wherein the inner conductive liquid portion of the cathode contact ring comprises mercury or KCl solution.
Dependencies are inferred from the claim text.