Apparatus and method for fabricating bonded substrate
AssigneeFujitsu Limited
InventorsTakanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Abstract
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
Claims4
A method of bonding two substrates held by first and second holding plates arranged to face each other in a process chamber, the method comprising:
- vacuum holding at least one of the two substrates by at least one of the first or second holding plates in the process chamber;
- feeding a gas in the process chamber to elevate pressure in the process chamber to a predetermined elevated pressure higher than the atmospheric pressure;
- electrostatically holding said at least one of the two substrates by said at least one of the first or second holding plates after the pressure in the process chamber is elevated to the predetermined elevated pressure,
- pressing the two substrates to bond to each other after said electrostatically holding said at least one of the two substrates;
- and
- stopping the vacuum holding before pressing the two substrates.
Dependencies are inferred from the claim text.