Electroless plating systems and methods

A system comprising:

• a point-of-use process chamber including a drain and configured to apply a plating solution to plate one or more wafers by spray, microcell, or spin on;
• a plurality of tanks to separately hold constituent chemicals of the plating solution;
• a piping system having a plurality of segments, including a plurality of in-line heaters for a subset of the segments, to separately route, in-line heat, and after heating, mix, at a mixing point, the constituent chemicals of the plating solution to form the plating solution, substantially just prior to application to the one or more wafers;
• and
• a system controller configured to receive results of a qualification analysis of the plating solution and control a supply to the mixing point of the constituent chemicals, by interfacing with the plurality of tanks, based on the qualification analysis.