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US 7,597,603 B2Granted
Method of encapsulating a display element
AssigneeCorning Incorporated
InventorsKeith James Becken, Stephan Lvovich Logunov
Life of this patent
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Abstract
A method of encapsulating a display device between substrates with a glass frit. The method includes depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate wherein the deposited frit has a height h, placing a second substrate in contact with the frit, sealing together the substrates by traversing a laser light having a wavelength λ over the frit at a speed greater than about 5 mm/s, and wherein α·h at λ is between 0.4 and about 1.75.
Claims15
A method for encapsulating a display element comprising:
- depositing a frit having an optical absorption α which is a function of wavelength onto a first substrate in the shape of a wall having a height h;
- sandwiching the frit between the first substrate and a second substrate having a display element and at least one electrode disposed thereon, the at least one electrode extending between the frit and the second substrate;
- heating the frit by traversing a laser light having a wavelength λ over the frit through the first substrate at a speed greater than about 40 mm/s to melt the frit and seal together the first and second substrates;
- and
- wherein α·h at λ is greater than or equal to about 0.4.
2 more elements
A method of encapsulating a display element comprising:
- depositing a frit selected to have an optical absorption α at a wavelength λ onto a first substrate as a wall having a height h between 10 μm and 30 μm;
- pre-sintering the frit;
- placing the first substrate overtop a second substrate having one or more display elements comprising an organic material and at least one metallic electrode disposed thereon, such that the display element is encircled by the wall and the at least one electrode passes beneath the frit;
- heating the frit through the first substrate by traversing a laser beam having a peak optical power at wavelength λ over the frit at a speed greater than 20 mm/s to melt the frit and form a hermetic seal between the first and second substrates;
- and
- wherein the frit is selected such that α·h at λ is greater than or equal to about 0.4.
3 more elements
Dependencies are inferred from the claim text.