Apparatus and method for producing a bonding connection
AssigneeInfineon Technologies AG
InventorDirk Siepe
Life of this patent
Estimating the term…
Abstract
One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation. One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position. In the first active position, the heel shaper ensures that the bonding wire runs in a permissible region in the heel region.
Claims12
A method for producing a bonding connection comprising:
- providing a bonding stamp comprising a guide area for guiding a bonding wire and which may be moved in a vertical direction;
- providing a guide device arranged laterally alongside the bonding stamp for guiding a bonding wire;
- and
- providing a heel shaper arranged on that side of the bonding stamp which is remote from the guide device and which comprises a guide area for guiding a bonding wire, and which is situated in a first active position relative to the bonding stamp or which may be moved into a defined first active position relative to the bonding stamp;
- inserting a bonding wire such that the bonding wire is guided along the guide device and along the guide area of the bonding stamp;
- defining a predetermined first bonding location on a first bonding partner to which the bonding wire is to be bonded onto the first bonding partner;
- lowering the bonding stamp together with the bonding inserted wire in the direction of the predetermined first bonding location until the bonding wire touches the first bonding partner at the predetermined first bonding location;
- and
- bonding the bonding wire to the first bonding partner at the predetermined first bonding location.
Dependencies are inferred from the claim text.