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US 7,597,232 B2Granted
Apparatus for applying conductive paste onto electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJae Taek Kim
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJae Taek Kim
Estimating the term…
An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig unit, for allowing the conductive paste to be applied onto the electronic component. The conductive paste is applied onto the electronic component, while the electronic component is loaded onto or unloaded from the first jig unit. The apparatus and the method allow the conductive paste for forming electrodes to be precisely applied onto the electronic component, easily adjust the amount of the applied conductive paste, prevent the spreading of the conductive paste or the incorrect application of the conductive paste, allow jig units, for applying the conductive paste onto the electronic component, to be used for a long time without replacement or washing, cause the reduction of the maintenance costs of the apparatus, and facilitate the formation of electrodes having various shapes on the electronic component.
An apparatus for applying a conductive paste onto an electronic component comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
No references of this kind are recorded.
Forming printed elements for providing electric connections to or between printed circuits: edge contacts; Windows or holes in the substrate…
Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups…:…
Use of materials for the conductive, e.g. metallic pattern: dispersed materials, e.g. conductive pastes or inks
For patterning or coating: female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
Term ended 19 Sep 2026 (estimated)
The present application is based on, and claims priority from, Korean Application Number 2005-85722 filed on Sep. 14, 2005, the disclosure of which is hereby incorporated by reference herein in its entirety.
1. Field of the Invention
The present invention relates to an apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, especially a (micro) chip device, and more particularly to an apparatus and a method for applying a conductive paste onto an electronic component to allow the conductive paste to be precisely applied onto the electronic component and to precisely adjust the amount of the applied conductive paste.
The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a perspective view of a conventional chip device;
FIG. 2 is a perspective view of a conventional highly dense chip device;
Now, preferred embodiments of the present invention will be described in detail with reference to the annexed drawings.
First, FIG. 5 illustrates an apparatus 1 for applying a conductive paste onto an electronic component in accordance with one embodiment of the present invention.
As shown in FIG. 5, the apparatus 1 of the present invention comprises a first jig unit 10 and a second jig unit 30.