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US 7,597,005 B2Granted
Pressure sensor housing and configuration
AssigneeHoneywell International Inc.
InventorSteven M. McMonigal
Life of this patent
Estimating the term…
Abstract
A pressure sensor housing and configuration is provided for a single-square-sensor (SSS) sensing die. A sensor includes a glass wafer hermetically bonded to the SSS chip. The SSS chip is then positioned between a header and a cover, which can be glued together using an epoxy, for example. A tube, such as a pyrex tube, is connected to the SSS chip through which pressure is sensed. After bonding the wafer to the SSS chip, a vacuum seal is created and thus less emphasis is placed on hermetically sealing the remainder of the sensor.
Claims20
A sensor comprising:
- a single sensing die having a tangential resistance when current flow is tangential to the sensing die and a radial resistance when current flow is radial to the sensing die, and wherein a tangential voltage across the tangential resistance and a radial voltage across the radial resistance can be measured to determine a magnitude of a pressure applied to the single sensing die;
- and
- a wafer cover having a recessed portion, the wafer cover bonded to a surface of the single sensing die providing a vacuum seal within the recessed portion between the wafer cover and the single sensing die.
A pressure and temperature sensor comprising:
- a header;
- a cover coupled to the header;
- a sensing die positioned in an area between the header and cover;
- and
- a wafer cover having a recessed portion, the wafer cover being hermetically bonded to the sensing die to provide a vacuum seal as a reference pressure within the recessed portion.
2 more elements
A sensor comprising:
- a single square sensing die, the single square sensing die having a tangential resistance when current flow is tangential to the sensing die and a radial resistance when current flow is radial to the sensing die, and wherein by changing a direction of current through the single square sensing die a tangential voltage across the tangential resistance and a radial voltage across the radial resistance can be measured to determine a magnitude of a pressure applied to the single square sensing die and to determine a magnitude of an ambient temperature of the single square sensing die;
- a sensor cover hermetically bonded to the single square sensing die;
- and
- a header coupled to a cover to form a housing, wherein the single square sensing die is positioned within the housing.
1 more element
Dependencies are inferred from the claim text.