Micro-electromechanical devices and methods of fabricating thereof
AssigneesAgency for Science, Technology and Research, Sony Corporation
InventorsKui Yao, Xiao Song Eric Tang, Peng Gao, Xujiang He, Jian Zhang, Santiranjan Shannigrahi
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Abstract
An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Claims24
A method for fabricating an electromechanical device comprising:
- forming a support structure having first and second support surfaces including
- providing a first layer, wherein the first layer comprises single crystal silicon with a <110> crystallographic direction parallel to a sandwich direction of a first, second and third layer sandwich,
- providing second and third layers, each having inner and outer surfaces, and
- attaching the inner surfaces of the second and third layers to the first layer to form the support structure, the outer surfaces of the second and third layers form the first and second support surfaces, wherein the support structure comprises at least one cavity between the second and third layers, the cavity is located adjacent to the inner surfaces of the second and third layers;
- and
- providing an electromechanical active element on at least one of the first and second support surfaces.
A method for fabricating an electromechanical device comprising:
- forming a support structure having first and second support surfaces including
- providing a first layer,
- providing second and third layers, each having inner and outer surfaces, and
- attaching the inner surfaces of the second and third layers to the first layer to form the support structure, the outer surfaces of the second and third layers form the first and second support surfaces, wherein the support structure comprises at least one cavity between the second and third layers, the cavity is located adjacent to the inner surfaces of the second and third layers;
- providing an electromechanical active element on at least one of the first and second support surfaces;
- and
- wherein first, second and third wafers are provided for the first, second and third layers and further comprises
- forming a cavity array in the first wafer;
- attaching inner surfaces of the second and third wafers to the first wafer to form a wafer stack;
- providing electromechanical active elements on the outer surface of at least one of the second and third wafers;
- and
- dicing the wafer stack to form a plurality of electromechanical devices in parallel in a single fabrication cycle.
A method for fabricating a support structure for an electromechanical device comprising:
- providing a first layer, the first layer comprises a first substrate with opposing surfaces having a primary slot;
- providing second and third layers, the second and third layers comprise second and third substrates having inner and outer surfaces;
- attaching the inner surfaces of the second and third substrates to respective opposing surfaces of the first substrate to form a substrate stack;
- cutting the substrate stack to form one or more support structures, wherein a support structure includes at least one cavity between the inner surfaces of the second and third substrates corresponding to the primary slot;
- and
- wherein at least one of the outer surfaces of the second or third layers serve as a support surface for an electromechanical active element.
Dependencies are inferred from the claim text.