Method for manufacturing piezoelectric thin film resonator
AssigneeSeiko Epson Corporation
InventorsSetsuya Iwashita, Takamitsu Higuchi
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Abstract
To provide a method for manufacturing a piezoelectric thin film resonator with excellent characteristics. A method for manufacturing a piezoelectric thin film resonator in accordance with the present invention includes a step of forming a laminated body by successively laminating, above a first substrate, a piezoelectric thin film and a first electrode, a step of bonding a second substrate and the laminated body, a step of separating the first substrate from the laminated body, a step of forming a second electrode above the piezoelectric thin film, and a step of patterning the second electrode, the piezoelectric thin film and the first electrode.
Claims2
A method for manufacturing a piezoelectric thin film resonator, comprising:
- forming a buffer layer including MgO or SrO, above a single-crystal sapphire substrate;
- forming a piezoelectric thin film above the buffer layer;
- forming a first electrode above the piezoelectric thin film;
- forming a protection layer above the first electrode;
- preparing a silicon substrate having a silicon oxide layer;
- bonding the silicon substrate to the single-crystal sapphire substrate having the buffer layer, the piezoelectric thin film, the first electrode and the protection layer;
- separating the single-crystal sapphire substrate from the piezoelectric thin film by etching the buffer layer;
- after separating the single-crystal sapphire substrate from the piezoelectric thin film forming a second electrode above the piezoelectric thin film;
- and
- patterning the second electrode, the piezoelectric thin film and the first electrode.
Dependencies are inferred from the claim text.