Process control system, process control method, and method of manufacturing electronic apparatus

A process control method comprising:

• preparing, by executing a test manufacturing process with respect to a test wafer, a correlation between a test monitored value of apparatus information indicating a processing state of a manufacturing apparatus and a feature quantity obtained from a processing parameter for controlling the manufacturing apparatus and a finished form in the test manufacturing process;
• acquiring, by executing a reference manufacturing process with respect to a plurality of reference wafers, a plurality of reference monitored values of the apparatus information with respect to said plurality of reference wafers;
• determining abnormal values in a distribution of said plurality of reference monitored values;
• calculating on the basis of the correlation a plurality of estimated values of the feature quantity respectively corresponding to said plurality of reference monitored values except for the abnormal values;
• calculating a setting value of the processing parameter in objective manufacturing process on the basis of a dimension of a processing objective structure in the objective manufacturing process with respect to an objective wafer, and at least one of said plurality of estimated values;
• preparing a processing recipe in which the setting value is described in a processing step in the objective manufacturing process;
• classifying abnormal values which are reproduced by an appearance distribution region among the abnormal values determined in the distribution of the reference monitored values into an abnormal mode;
• and
• preparing a new correlation between the abnormal value of a first abnormal wafer classified into the abnormal mode, and a feature quantity calculated on the basis of a finished form of the first abnormal wafer.

A method of manufacturing an electronic apparatus, comprising:

• preparing, by executing a test manufacturing process with respect to a test wafer, a correlation between a test monitored value of apparatus information indicating a processing state of a manufacturing apparatus, and a feature quantity obtained from a processing parameter for controlling the manufacturing apparatus and a finished form in the test manufacturing process;
• collecting, by executing a reference manufacturing process with respect to a plurality of reference wafers, a plurality of reference monitored values of the apparatus information with respect to said plurality of reference wafers;
• determining abnormal values in a distribution of said plurality of reference monitored values;
• calculating on the basis of the correlation a plurality of estimated values of the feature quantity respectively corresponding to said plurality of reference monitored values except for the abnormal values;
• calculating a setting value of the processing parameter in an objective manufacturing process on the basis of a dimension of a processing objective structure in the objective manufacturing process with respect to an objective wafer, and at least one of said plurality of estimated values;
• preparing a processing recipe in which the setting value described is in a processing step in the objective manufacturing process;
• processing the objective wafer by the manufacturing apparatus in accordance with the processing recipe;
• classifying abnormal values which are reproduced by an appearance distribution region among the abnormal values determined in the distribution of the reference monitored values into an abnormal mode;
• and
• preparing a new correlation between the abnormal value of a first abnormal wafer classified into the abnormal mode, and a feature quantity calculated on the basis of a finished form of the first abnormal wafer.