Photoresist composition, and low-molecular compound and high-molecular compound for the photoresist composition

A photoresist composition comprising:

• (A) a base resin component having alkali-solubility changed by the action of an acid;
• and (B) an acid generator for generating an acid by irradiation with radiation rays, wherein the base resin component (A) comprises a compound having an alkali-soluble site (i), at least a part of the alkali-soluble site (i) is protected with (ii) a halogen atom-containing acetal type dissolution inhibiting group, and the dissolution inhibiting group (ii) ) is a group represented by the following general formula (1):
• —O—C(R1)(R2)—O—R3 (1)
• wherein R1 and R2 independently represent a hydrogen atom or a lower alkyl group, and R3 is a group represented by the following general formula (2):
• —[C(R5)(R6)]n—R4 (2)
• wherein R4 is a halogen-containing norbornenyl group, R5 and R6 independently represent a hydrogen atom or a lower alkyl group, and n is 0 or an integer of 1 to 3, wherein the alkali-soluble site (i) is at least one member selected from the group consisting of an alcoholic hydroxyl group and a hydroxyl group of a carboxyl group.