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US 7,587,805 B2Granted
Reconfigurable fixture device and methods of use
AssigneeGM Global Technology Operations LLC
InventorsAlan L. Browne, Douglas M. Linn, Nilesh D. Mankame, Roland J. Menassa, Ivan G. Sears, Robin Stevenson, Christopher P. Henry, Nancy L. Johnson, Charles W. Wampler, II
Life of this patent
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Abstract
A fixture device generally includes a base member, a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a shape memory material configured to selectively conform to a surface contour of a workpiece, and an activation device in operative communication with the shape memory material.
Claims11
A fixture device, comprising:
- a base member;
- a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece;
- and
- an activation device in operative communication with the share memory material,
- wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship T.sub.w<T.sub.g<T.sub.t.ltoreq.T.sub.r<M.sub.d, T.sub.max, wherein T.sub.w is a working temperature for the fixture device;
- T.sub.g is a first thermal transition temperature of the shape memory polymer;
- T.sub.t is a temperature employed for configuring the reconfigurable pad;
- T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape;
- M.sub.d is a temperature above which the shape memory alloy loses its shape memory properties;
- and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer.
7 more elements
A fixture device, comprising:
- a base member;
- a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a shape memory material configured to selectively conform to a surface contour of a workpiece;
- and an activation device in operative communication with the shape memory material, wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship T.sub.w<T.sub.g<T.sub.t<A.sub.s<A.sub.f<T.sub.r<M.sub.d-, T.sub.max, wherein T.sub.w is a working temperature for the fixture device;
- T.sub.g is a first thermal transition temperature of the shape memory polymer;
- T.sub.t is a temperature employed for configuring the reconfigurable pad;
- A.sub.s is an austenite start temperature of the shape memory alloy;
- A.sub.f is an austenite finish temperature of the shape memory alloy;
- T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape;
- M.sub.d is a temperature above which the shape memory alloy loses its shape memory properties;
- and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer.
7 more elements
A fixture device, comprising:
- a base member;
- a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece;
- and
- an activation device in operative communication with the share memory material,
- wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship A.sub.f<T.sub.w<T.sub.g<T.sub.t.ltoreq.T.sub.r<M.sub.d, T.sub.max, wherein A.sub.f is an austenite finish temperature of the shape memory alloy;
- T.sub.w is a working temperature for the fixture device;
- T.sub.g is a first thermal transition temperature of the shape memory polymer;
- T.sub.t is a temperature employed for configuring the reconfigurable pad;
- T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape;
- M.sub.d is a temperature above which the shape memory alloy loses its shape memory properties;
- and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer.
8 more elements
A fixture device, comprising:
- a base member;
- a reconfigurable pad disposed on the base member, wherein the reconfigurable pad comprises a share memory material configured to selectively conform to a surface contour of a workpiece;
- and
- an activation device in operative communication with the share memory material,
- wherein the shape memory material of the reconfigurable pad is a composite comprising a shape memory alloy and a shape memory polymer, and wherein the shape memory polymer and the shape memory alloy are selected in accordance with a temperature relationship T.sub.w<T.sub.g, M.sub.f<T.sub.t.ltoreq.T.sub.r<A.sub.s<T.sub.a.ltoreq.A.sub.f<-;
- T.sub.max, wherein T.sub.w is a working temperature for the fixture device;
- T.sub.g is a first thermal transition temperature of the shape memory polymer;
- M.sub.f is a martensite finish temperature of the shape memory alloy;
- T.sub.t is a temperature employed for configuring the reconfigurable pad;
- T.sub.r is a temperature employed for recovery of the reconfigurable pad to an original shape;
- A.sub.s is an austenite start temperature of the shape memory alloy;
- T.sub.a is an actuation temperature for the shape memory alloy;
- A.sub.f is an austenite finish temperature of the shape memory alloy;
- and T.sub.max is a lesser of a last transition temperature or an oxidation temperature for the shape memory polymer.
11 more elements
Dependencies are inferred from the claim text.