Substrates for optical die structures
OwnerOmar J. Bchir, Islam Salama +4inventors
InventorsOmar J. Bchir, Islam Salama, Charan Gurumurthy, Houssam Jomaa, Ravi Nalla, Yonggang Li
Life of this patent
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Abstract
Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate, and one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from a motherboard.
Claims23
An apparatus comprising:
- a package substrate comprising one or more plated through hole (PTH) structures;
- an optical waveguide coupled with the package substrate, the optical waveguide comprising one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate;
- and
- one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from the package substrate.
An apparatus comprising:
- a package substrate comprising a peripheral region and a central region;
- and
- an optical waveguide coupled with the peripheral region of the package substrate, the optical waveguide comprising a laser-patterned glass, one or more input/output (I/O) optical signal pads and one or more I/O optical signal traces, the I/O optical signal pads being optically coupled to the one or more I/O optical signal traces, to route I/O optical signals to and from one or more electronic devices.
A method comprising:
- fabricating a package substrate comprising an optical waveguide having input/output (I/O) optical signal pathways to route I/O optical signals to and from the package substrate by bundling one or more optical fibers through one or more plated-through hole structures of the package substrate or weaving one or more optical fibers into a package substrate core material, or combinations thereof, the one or more optical fibers being coupled to the I/O optical signal pathways of the optical waveguide in a central region of the package substrate;
- coupling the I/O optical signal pathways of the optical waveguide to one or more I/O optical structures of a semiconductor die;
- and
- optically coupling a motherboard with the I/O optical signal pathways of the optical waveguide.
A method, comprising:
- fabricating a package substrate comprising an optical waveguide having input/output (I/O) optical signal pathways to route I/O optical signals to and from the package substrate, wherein fabricating the package substrate comprises forming one or more power delivery bumps in a central region of the package substrate and forming the I/O optical signal pathways in a peripheral region of the package substrate using a focused laser beam to alter the index of refraction of the optical waveguide material such that the index of refraction of the I/O optical signal pathways is different than the index of refraction of optical waveguide material not exposed to the focused laser beam;
- coupling the I/O optical signal pathways of the optical waveguide to one or more I/O optical structures of a semiconductor die;
- and
- optically coupling a motherboard with the I/O optical signal pathways of the optical waveguide.
A method, comprising:
- fabricating a package substrate comprising an optical waveguide having input/output (I/O) optical signal pathways to route I/O optical signals to and from the package substrate, wherein fabricating the package substrate comprises:
- depositing a build-up dielectric layer to a package substrate core;
- depositing a solder resist layer to the build-up dielectric layer;
- and
- depositing an optically transparent underfill layer to the solder resist layer;
- coupling the I/O optical signal pathways of the optical waveguide to one or more I/O optical structures of a semiconductor die;
- and
- optically coupling a motherboard with the I/O optical signal pathways of the optical waveguide.
Dependencies are inferred from the claim text.