Method for fabricating wiring board and an apparatus for fabricating wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorKenji Yanagisawa
Life of this patent
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Abstract
There is provided a method for fabricating a wiring board including: a mounting step of mounting a light transmitting member, the mounting step including: an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a wiring board main body, and a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light transmitted through the light transmitting member and the holder.
Claims9
A method for fabricating a wiring board comprising:
- a mounting step of mounting a light transmitting member, the mounting step including:
- an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a wiring board main body;
- and
- a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light that is irradiated to enter one outside surface of the holder and exit an opposite outside surface of the holder, and thus is transmitted through the light transmitting member and the holder.
An apparatus for fabricating a wiring board by mounting a light transmitting member thereon, comprising:
- a light transmitting holder for holding the light transmitting member to arrange the light transmitting member at a wiring board main body;
- and
- a light irradiator for curing a photo-curing resin material between the light transmitting member and the wiring board main body by irradiating light that enters one outside surface of the holder and exits an opposite outside surface of the holder, and thus is transmitted through the holder and the light transmitting member.
Dependencies are inferred from the claim text.