Printed circuit board including embedded passive component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Sup Ryu, Myung Sam Kang
Life of this patent
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Abstract
Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.
Claims6
A printed circuit board including an embedded passive component, comprising:
- at least one circuit layers in which circuit patterns are formed;
- at least one insulating resin layer interposed between the circuit layers;
- a pair of terminals which is vertically formed through the insulating resin layers, plated with a first conductive material, and separated from each other by a predetermined distance;
- the embedded passive component which is interposed between the pair of terminals and which has electrodes formed on both sides thereof, the electrodes being separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material;
- at least one second insulating layer laminated on the embedded passive component and the insulating resin layer;
- and
- at least one lower land formed on the at least one insulating layer and contacting the second conductive material.
Dependencies are inferred from the claim text.